Growing Electronic Sector and Launch of Tools for 3D Co-Packaging of Chips and Chiplets to Augment Growth of 3D ICs Market

 

3D ICs Market

A three-dimensional integrated circuits are designed with several conductive layers, usually consisting of conductive layers having different levels of conductivity and electrical characteristicss. The layers are typically packaged together using polyester wiring, but other types of packaging are also available. The layers can be stacked in a vertical fashion, and one layer can serve as a topmost layer, while other layers can support the bottom layers. A finished three-dimensional integrated circuit can have an input, output, input, and power level indicator layer.

Market Dynamics

Growing the electronic sector is expected to boost demand for 3D ICs, thereby propelling growth of the global 3D ICs market. For instance, according to India Brand Equity Foundation, the electronics market in India is expected to witness a CAGR of 24.4% during 2012–20. Moreover, significant growth in the telecommunication sector is also expected to aid in growth of the market.  For instance, according to Pew Research Center, as of February 2019, 81% of U.S. adults used smartphones compared to 77% in October 2018.  

Launch of tools for the 3D co-packaging of chips and chipsets is expected to offer lucrative growth opportunities for players in the global 3D ICs market. For instance, in February 2021, Monozukuri SpA, a provider of early floorplanning for 2.5D and 3D IC integration solutions, launched a design tool for the 3D co-packaging of chips and chipsets down to the PCB level. Moreover, increasing adoption of PCs is also expected to aid in growth of the market. For instance, according to Gartner, Inc., worldwide PC shipments totaled 70.6 million units in the fourth quarter of 2019, a 2.3% increase from the fourth quarter of 2018.

Among regions, North America is expected to witness significant growth in the 3D ICs market, owing to initiatives to accelerate access to domestic development and manufacturing services for microelectronics advanced packaging. For instance, in January 2021, SkyWater Technology, the U.S.-owned and operated pure play foundry, announced a public-private partnership with Osceola County, Florida and BRIDG to accelerate access to domestic development and manufacturing services for microelectronics advanced packaging.

Competitive Analysis

Major players operating in the global 3D ICs market include Samsung, Taiwan Semiconductor Manufacturing Company, Ltd., MonolithIC 3D Inc., XILINX, Inc., Elpida Memory, Inc. (Micron Technology, Inc.), The 3M Company, Ziptronix, Inc., STATS ChipPAC Ltd., United Microelectronics Corporation, and Tezzaron Semiconductor Corporation.

Major players operating in the global 3D ICs market are focused on launching new products to expand their product portfolio. For instance, in August 2020, Samsung launched X-Cube, its new 3D IC technology at both 7nm and 5nm. 

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