Growing Electronic Sector and Launch of Tools for 3D Co-Packaging of Chips and Chiplets to Augment Growth of 3D ICs Market
A three-dimensional integrated circuits are designed with several conductive layers, usually consisting of conductive layers having different levels of conductivity and electrical characteristicss. The layers are typically packaged together using polyester wiring, but other types of packaging are also available. The layers can be stacked in a vertical fashion, and one layer can serve as a topmost layer, while other layers can support the bottom layers. A finished three-dimensional integrated circuit can have an input, output, input, and power level indicator layer. Market Dynamics Growing the electronic sector is expected to boost demand for 3D ICs, thereby propelling growth of the global 3D ICs market . For instance, according to India Brand Equity Foundation, the electronics market in India is expected to witness a CAGR of 24.4% during 2012–20. Moreover, significant growth in the telecommunication sector is also expected to aid in growth of the market. For instance, ...